History
He currently serves as Vice President of Hon Hai Technology and Head of Semiconductor Business Group of Hon Hai Technology. He began his career with Motorola Advanced Product Research Laboratory doing power PC and embedded memory research and development (“R&D”) in 1994. He joined TSMC in 1998 as R&D Manager and then was promoted to Deputy Director in charge of integration of several technology nodes and various technology flavours for 10 years.
In 2008, he joined TSMC’s package subsidiary Xintec Inc as R&D Vice President doing research in wafer level package, pioneering on TSV and 3DIC package. In 2009 to 2011 he started his own company MOS Art Packaging to continue developing wafer level package products. He then joined Neo Solar Power (“NSP”) in 2011 as R&D Vice President and then was promoted to be President of Cell Business Unit.Through his leadership, NSP maintained the highest efficiency of p-type solar cell and module mass production, and built three solar cell fabs in three different countries outside Taiwan. He also realised the first n-type heterojunction solar cell (HJT) mass production in Taiwan.
He joined Hon Hai Technology group as VP and special assistant to founder Terry Guo in 2017. He joined Hon Hai semiconductor group in 2019. Since then he has served on the board of Hon Hai group’s subsidiaries including Sharp, Foxsemicon, Shun Sin Technology, and Socle technology. He has established several semiconductor start-up’s across fields from package to IC design within Hon Hai Technology group. He has about 30 patents and 40 publications.
He received his M.S. and Ph.D. in Electrical Engineering specialised in microelectronics from University of Texas at Austin in 1990, and 1994 respectively. He has an EMBA degree from National Chiao-Tung University, Taiwan, and a B.S. degree in Materials Science from National Tsing-Hua University, Taiwan.
